Substrate carrier system

US5755473A · kind A · utility

Assignee

• Xerox Corporation · US

Inventors

• Eugene A. Swain · Webster, US
• Thomas E. Smith · Atlanta, US
• Alan D. Smith · Henrietta, US
• Robert S. Foltz · Rochester, US
• Peter Schmitt · Erlangen, DE
• Stanley J. Pietrzykowski, Jr. · Rochester, US
• Kamran U. Zaman · Pittsford, US

Key dates

• Filing date: Aug 9, 1996
• Grant date: May 26, 1998
• Expiry date: Aug 9, 2016

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6715
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

There is disclosed a carrier system for carrying a substrate batch including: PA1 (a) a heat treated, integral pallet having a pallet thickness, a top surface, and a bottom surface, wherein the pallet defines a plurality of passageways extending completely through the pallet thickness to form a first plurality of openings on the top surface and the bottom surface, wherein the pallet also defines a plurality of chambers extending through at least a portion of the pallet thickness to form a second plurality of openings on the bottom surface; and PA1 (b) a plurality of chuck assemblies partially disposed in the plurality of the chambers and adapted to engage the substrate batch, wherein the pallet has sufficient structural rigidity such that while the carrier system is carrying the substrate batch, even when the carrier system is subjected to an elevated temperature, there is absent any appreciable bending and twisting of the pallet.