Electroding of ceramic piezoelectric transducers
US5755909A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 26, 1996 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Jun 26, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1043
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In the embodiments described in the specification, electrodes are bonded to the surface of a ceramic piezoelectric layer by supporting electrodes having a reduced dimension on a flexible dielectric film and placing the dielectric film under tension to expand the film and the electrodes sufficiently to conform the electrodes to the desired electrode pattern on the ceramic piezoelectric layer. The electrodes are then bonded to the piezoelectric layer with an adhesive bonding agent under pressure applied hydraulically so as to be distributed uniformly throughout the surface of the piezoelectric layer. In one embodiment the dielectric film also carries conductor arrays for connecting the electrodes to remote driver chips at locations spaced from the surface of the piezoelectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.