Electroplating system and process
US5755948A · kind A · utility
25Cited by
6References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1997 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Jan 23, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a system and process for electroplating that has plating drums whereby the plating drums are filled, and emptied of parts at each individual plating cell and the parts are cleansed by spraying, wiping and/or drying and whereby only cleansed parts are transported from plating cell to plating cell. This results in less contamination and higher efficiencies in plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.