Epoxy resin composition for encapsulation of semiconductors
US5756564A · kind A · utility
5Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1997 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Feb 25, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
To provide an epoxy resin composition for encapsulation of semiconductors, which is superior in curability and can yield a cured product having low moisture absorption. The epoxy resin composition comprises the following components (a), (b), (c), and (d): PA1 (a) Epoxy resin PA1 (b) Epoxy resin hardener comprising a partially aromatic-esterified phenol aralkyl resin having a conversion of esterification of 10 to 90 mol % as the main component PA1 (c) Silica powder filler PA1 (d) Cure accelerator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.