Photosensitive polymide materials for electronic packaging applications
US5756648A · kind A · utility
7Cited by
3References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 25, 1995 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Oct 25, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0387
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Photosensitive polyimides (Ps-PIM) materials have been synthesized that belong to three families of Ps-PIM materials. Through the use of precursors, various catalytic compositions with differing photosensitivities are provided. The results are Ps-PIM materials having increased photosensitivities at wavelengths longer than approximately 330 to 350 nm and an associated catalytic system that is insensitive to oxygen. A variety of applications, including use in holographic systems, are improved by the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.