Wide frequency band transition between via RF transmission lines and planar transmission lines
US5757252A · kind A · utility
71Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1996 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Jun 11, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4611
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer circuit structure including a plurality of substrate layers. At least one planar transmission line, including microstrip, stripline, or coplanar line, disposed on the plurality of substrate layers. A via transmission line connected to that at least one planar transmission line and extending through the plurality of substrate layers. The via transmission lines having the same topology as the at least one planar transmission line for providing wide frequency band transition between the via transmission lines and the at least one planar transmission line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.