Electronic package having buried passive components
US5757611A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1996 |
| Grant date | May 26, 1998 |
| Priority date | — |
| Expiry date | Apr 12, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4688
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides for an electronic package having a buried passive component such as a capacitor therein, and a method for fabricating the same. The electronic package preferably includes a passive component portion which includes a plurality of layers of high K dielectric material, a signal processing portion which includes a plurality of layers of low K dielectric material, and at least one buffer layer interposed between the passive component portion and the signal processing portion. Metallization is preferably printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material. Preferably, the layers are co-fired at a temperature below approximately 1200.degree. C. to form the electronic package and each of the buffer layers contains approximately 25 to 100% barium compound. Via conductors may also be provided through the buffer layers to electrically couple the passive component portion and the signal processing portion and the metallization and the via conductors may be selected from highly conductive materials such as gold, silver, copper and alloys thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.