Method of manufacturing multilayer electronic components
US5758398A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Jun 27, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a plurality of multilayer electronic components, comprises the steps of: PA1 (a) Manufacturing a laminated sheet (1) in which layers of ceramic tape are each provided on one side with a pattern of electrodes; are stacked so that the electrode patterns on consecutive layers are offset back and forth with respect to one another, and are pressed together, cutting the laminated sheet into segments in which consecutive electrodes with a gas cooled laser beam, are alternately exposed at a different segment edge with a gas cooled laser beam; sintering the segments and providing electrical contacts which interconnect the electrodes exposed at given segment edges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.