Field emission device with close-packed microtip array
US5759078A · kind A · utility
14Cited by
17References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Jul 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electron emitter plate (110) for an FED image display has an extraction (gate) electrode (22) spaced by an insulating layer (125) from a cathode electrode including a conductive mesh (18). Hexagonal close-packed arrays (12) of microtips (14) are located in mesh spacings (16), within apertures (26) formed in extraction electrode (22). Microtips (14) are formed on a conductive plate (17) laterally spaced from mesh structure (18) by a resistive layer (15). Insulating layer (125) is etched to connect apertures (26) and place microtips (14) in a common cavity within each mesh spacing (16).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.