Sanding pad containing a heat distortable polymer and sanding process using same
US5759090A · kind A · utility
20Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Nov 20, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D15/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A sanding pad (102, 204) comprising a plate-shaped substrate (104, 201) and an abrasive (103, 203) fixed by the use of a fixing means (102, 202) onto a major surface of the substrate (104, 201), and the substrate (104, 201) having a heat distortable polymer which has a dimension-retaining first state within a normal use temperature range of said pad (102, 204) and a deformable state at a temperature above said normal use temperature range. The invention provides an inexpensive sanding pad capable of sanding a three-dimensional curved surface, uniformly and easily, which is superior in repeated usability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.