Sn-Bi alloy-plating bath and method for forming plated Sn-Bi alloy film
US5759381A · kind A · utility
21Cited by
2References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 30, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Aug 30, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3473
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An Sn--Bi alloy-plating bath comprises (i) Bi ions, (ii) Sn ions, (iii) ions of one metal selected from the group consisting of Cu, Co and Ag, and (iv) one member selected from the group consisting of carboxylic acids, lactone compounds, alkanesulfonic acids, alkanolsulfonic aicds, phenolsulfonic acids and salts thereof and is substantially free of lead ions. The bath permits the formation of an Sn--Bi alloy-plated film, does not form any plated film having impaired quality even at a temperature higher than about 100.degree. C. and does not form any whisker.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.