Process for producing microstructure components on a substrate
US5759616A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1995 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Mar 10, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0735
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In a process for producing microstructure components on a substrate which carries electronic microcircuits cooperating functionally with the microstructure components, a first layer of a plastic material which connects with the substrate is applied to the substrate and a second layer of a plastic material which includes a separating agent but which firmly connects with the first layer is applied to the first layer and a molding tool is then impressed into the second layer to form the desired microstructures or to form cavities into the plastic material, which, upon removal of the molding tool, are filled with a metal to form the desired microstructures on the substrate upon removal of the plastic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.