Resist composition with polymeric dissolution inhibitor and alkali soluble resin
US5759739A · kind A · utility
26Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Apr 22, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resist composition comprising an alkali-soluble resin, typically a partially t-butoxycarbonylated polyhydroxystyrene, a p-butoxystyrene/t-butylacrylate copolymer or p-butoxystyrene/maleic anhydride copolymer as a dissolution inhibitor, and a iodonium or sulfonium salt as a photoacid generator is effective for forming a resist film which can be precisely and finely patterned using high energy radiation such as a KrF excimer laser.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.