Method of peeling photo-resist layer without damage to metal wiring
US5759751A · kind A · utility
7Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1997 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Feb 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31133
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturer peels a photo-resist mask off by using organic alkaline solvent, and the residual alkaline solvent is neutralized with acid before a rinse in pure water so as to prevent a metal wiring from erosion due to strong alkaline solution produced from the residual organic alkaline solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.