Sealant method of epoxy resin-clay composites
US5760106A · kind A · utility
47Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 13, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Sep 13, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K2200/0647
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A clay-resin composition of a cured epoxy resin and a layered clay with the cured epoxy resin in the galleries of the clay by intercalation or exfoliation. The preferred epoxy resins are flexible and usually elastic because of the epoxy resin and/or curing agent which is used. The result is a composite which can have superior tensile strength and/or solvent resistance as compared to the cured epoxy resin without the clay or with the clay but without the intercalation or exfoliation. The flexible composites are particularly useful for seals and other thin layer applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.