P-modified epoxy resin, phenolic OH compound and polyamine

US5760146A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Wolfgang von Gentzkow · Kleinsendelbach, DE
• Jürgen Huber · Erlangen, DE
• Heinrich Kapitza · Fürth, DE
• Wolfgang Rogler · Erlangen, DE

Key dates

• Filing date: Mar 10, 1997
• Grant date: Jun 2, 1998
• Expiry date: Mar 10, 2017

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/249952
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Epoxy resin mixtures for prepregs and composites Epoxy resin mixtures for preparing prepregs and composites contain the following components: PA1 a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from PA1 (a) polyepoxy compounds with at least two epoxy groups per molecule and PA1 (b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters; PA1 a glycidyl group-free compound with phenolic OH groups in the form of bisphenol-A, bisphenol-F, or a high-molecular phenoxy resin obtained through the condensation of bisphenol-A or bisphenol-F with epichlorohydrin; PA1 an aromatic polyamine used as a hardening agent.