Copolyamide composition with a high glass transition temperature and a low melting point
US5760167A · kind A · utility
1Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1995 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Nov 15, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A copolyamide composition prepared from hexamethylene diamine and mixtures of adipic acid, terephthalic acid and isophthalic acid, has a melting point below 300.degree. C., a glass transition temperature between 100.degree. C. and 130.degree. C. and physical properties similar to nylon 66.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.