Monitoring the bond line temperature in thermoplastic welds
US5760379A · kind A · utility
42Cited by
80References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1995 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Oct 26, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C66/9592
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Quality welds are highly dependent upon achieving appropriate temperatures everywhere along the bond line. The present invention uses multinode thermocouples to measure the bond line temperature in real time and to provide control signals for the moving coil (welding head).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.