Superconducting layer in contact with group III-V semiconductor layer for wiring structure
US5760463A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 14, 1996 |
| Grant date | Jun 2, 1998 |
| Priority date | — |
| Expiry date | Feb 14, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S505/866
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A superconductor device which includes a first wiring part and a second wiring part which together form a superconductive wiring. The first wiring part is arranged onto a substrate and is made of a superconductor material. The second wiring part is made of a non-oxide semiconductor material. The second wiring part is adjacent to the first wiring part and jointly forms a superconductive wiring with the first wiring part by becoming at least partly superconductive due to proximity effect with the first wiring part. The second wiring part has a smaller penetration length of magnetic field than that for the first wiring part. This structure enhances the propagation velocity of a signal within the superconductive wiring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.