Method of producing a semiconductor device using an expand tape
US5762744A · kind A · utility
29Cited by
6References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 1997 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Jun 6, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1179
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing a semiconductor device wherein a metal preform layer is applied to an expand tape followed by a step of adhering a wafer to the metal preform layer using an adhesive layer of a thin adhesive sheet on the preform layer. The metal preform layer and the wafer are cut into chips wherein each chip has adhered to the bottom a cut piece of the metal preform layer. The expand tape is then expanded to separate adjacent chips from each other, and each chip is then removed from the expanded expand tape and then die-bonded to a lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.