Method of encapsulating a sensor into a panel body
US5762853A · kind A · utility
10Cited by
19References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Apr 1, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2791/001
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A flexible sensor, such as a membrane switch, is molded into a plastic automotive panel by a low temperature, low pressure, method which avoids damage to the switch while insuring its placement at a desired depth below the surface of the panel. This is achieved by a process which includes a first step of spraying a mold with a rapid gelling liquid plastic to a preselected thickness. After the plastic has firmed, the sensor is placed thereon and is encapsulated by spraying with a second layer of the plastic. The resulting shell with the embedded sensor may then be provided with a backing, such as a plastic foam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.