Patent · US Expired

Method for fabricating thin film transistors

US5763301A · kind A · utility

16Cited by
16References
27Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 5, 1997
Grant dateJun 9, 1998
Priority date
Expiry dateFeb 5, 2017

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/6717

Abstract

A method for fabricating Thin Film Transistors includes the steps of forming a gate electrode on a substrate, forming a gate insulation film and a semiconductor layer successively on the substrate, forming a sidewall spacer only at one sidewall of the gate electrode on the semiconductor layer, and forming impurity regions in the semiconductor layer on both sidewalls of the gate electrode by ion-injecting impurity ions into the semiconductor layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.