Method for containing or removing contaminants from a substrate
US5763734A · kind A · utility
Inventors
Key dates
| Filing date | Oct 18, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Oct 18, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG21F9/28
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A method for containing or removing contamination from a substrate includes applying a material such as a polyurea elastomer to the contaminated substrate. Preferably, the material sets in less than about 1 hour and is substantially unaffected by exposure to radiation. The contaminants can be contained or shielded on the substrate by the material to reduce exposure to the contaminants. In one preferred embodiment, this invention relates to the encapsulation of objects or surfaces to shield persons in the area from contamination. Alternatively, the material can be removed from the substrate to remove contaminants. Preferably, the material provides a Decontamination Factor of at least about 10. In another preferred embodiment, the material is applied hot to the contaminated substrate to increase its effectiveness in removing contaminants. The present method can also prevent contamination of an uncontaminated substrate. The invention also provides a decontamination material including a polyurea elastomer and a wax.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.