Lid assembly for shielding electronic components from EMI/RFI interferences
US5763824A · kind A · utility
71Cited by
12References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Oct 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cover or lid assembly is provided for EMI/RFI shielding. The cover or lid is used in combination with an electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, a conductive frame, disposed about the electronic component. The conductive frame is electrically connected to the ground. An electrically conductive adhesive is disposed continuously between the frame and the lid to mount the lid to the conductive frame to shield the electronic component from electromagnetic and radio frequency interference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.