Wire bonding apparatus
US5763849A · kind A · utility
7Cited by
2References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 23, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Dec 23, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a wire bonding apparatus comprising a torch electrode for melting an end of a metallic thin wire to form a ball thereof, a high voltage detecting circuit for detecting a voltage between the metallic thin wire and the torch electrode in order to output the detected voltage as a voltage signal, a ball diameter calculator, and a ball diameter display device for displaying the ball diameter outputted from the ball diameter calculator, are further provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.