Infrared transceiver package
US5763900A · kind A · utility
12Cited by
0References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 5, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Dec 5, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An infrared transceiver packaging hardware including a substrate, a plurality of infrared emitting and receiving elements (IC, photoelectric diode or transistor, contact pins) fastened to the substrate by a wire bonding technique, a shielding case covered on said substrate and connecting it to earth, and an insert mode die filled up with a bonding compound, the shielding case with the substrate being inserted into the bonding compound in the insert mode die, and then sealed with the bonding compound together through a backing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.