Structure for testing bare integrated circuit devices
US5764070A · kind A · utility
66Cited by
5References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 21, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Feb 21, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2805
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test probe structure for making connections to a bare integrated circuit device or a wafer to be tested comprises a multilayer printed circuit probe arm which carries at its tip an MCM-D type substrate having a row of microbumps on its underside to make the required connections. The probe arm is supported at a shallow angle to the surface of the device or wafer, and the MCM-D type substrate is formed with the necessary passive components to interface with the device under test. Four such probe arms may be provided, one on each side of the device under test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.