Integrated circuit heat seat
US5764482A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jul 24, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Jul 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The apparatus is a heat sink for an integrated circuit chip which uses heat pipe cooling to remove the heat. The heat sink is a heat conductive structure such as a bowl which is associated with the integrated circuit socket, with the heat conductive structure held against the integrated circuit. A heat pipe is attached to the structure by using an extension from the heat conductive structure and wrapping the extension around a simple cylindrical heat pipe. One embodiment uses spring clips to attach the heat sink to the socket, and another version uses attachment screws through tabs which are formed from the material around a bowl shaped heat conductive structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.