Integrated semiconductor optical devices and method of manufacture employing substrate having alignment groove
US5764832A · kind A · utility
71Cited by
10References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 15, 1996 |
| Grant date | Jun 9, 1998 |
| Priority date | — |
| Expiry date | Oct 15, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing an integrated semiconductor optical device comprises forming an optical fiber positioning groove of a main surface of a support substrate, flattening the main surface of the support substrate, positioning an optical component on the flatted main surface, again exposing the groove, and assembling and positioning an optical fiber in the exposed groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.