BGA interconnectors
US5766021A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1996 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Oct 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1084
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A reusable socket adapted for use in making an electrical connection between an integrated circuit of a ball grid array (BGA) type package and a circuit board or test fixture. In one embodiment, the socket includes a return member for reshaping the socket. In a further embodiment, a socket assembly includes a plurality of spaced sockets. In an alternative embodiment, a socket assembly further includes a base member. In another embodiment, a socket is formed from a temperature dependent smart memory material. In a further embodiment, a socket assembly includes a plurality of sockets formed from a shape memory material. In an alternative embodiment, a zero insertion force (ZIF) or a low insertion force (LIF) socket assembly for a BGA package includes a plurality of sockets and a lever adapted for frictionally engaging respective BGA contact balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.