Substrate processing apparatus and substrate processing method
US5766360A · kind A · utility
75Cited by
11References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 25, 1993 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Mar 25, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67242
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate such as a semiconductor wafer is transferred to a plurality of process chambers so as to perform prescribed processes. An inspection chamber is air-tightly connected to each of the process chambers. The inspection chamber is provided with a handler which loads and unloads the substrate. A gate valve is disposed between each process chamber and the inspection chamber. By this gate valve, each chamber is air-tightly closed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.