Integrated circuit and process for its manufacture
US5767014A · kind A · utility
43Cited by
13References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1996 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Oct 28, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of a hyperbranched polymer and organic polysilica.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.