Copolyether ester hot-melt masses
US5767226A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1997 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Aug 12, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J167/025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to novel hot-melt masses consisting of a statistically built-up copolyether ester based on terephthalic acid in a mixture of aliphatic diols. Terephthalic acid is used as the single acid component and its molar amount, relative to the total amount of acid, is 100 molar %. A combination of butane diol, triethylene glycol and polyethylene glycol is present as diol component. The molar amount of butane diol is less than 80 molar %, the amount of triethylene glycol is between 15 and 60 molar % and at least 2 and at the most 10 molar % of a higher-molecular polyethylene glycol component with a molar mass of 600-4000 g/mole is used, relative to the total acid amount and total diol amount of 100 molar % in each instance. The melting point of the copolyether ester adhesive masses is between 90.degree. and 180.degree. C. The copolyetherester hot-melt masses can be used in the hot-melt method and for other known powder coating methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.