Plastic mold type semiconductor device
US5767566A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 15, 1996 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Aug 15, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20752
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor device according to the present invention can prevent the peeling-off of the chip from the die pad or the crack in the package by improving the efficiency of discharging of the moisture in the device even if the pitch of the inner leads is small, and can improve the reliability of the semiconductor device. The semiconductor device according to the present invention comprises a die pad holding a semiconductor chip, leads, bonding wires, and a plastic package containing the semiconductor chip, the die pad, a part of each of the leads, and the bonding wires. The bonding wires connected to the die pad extend to the outside of the plastic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.