Multilayered connector pads for supporting butt-joined optical arrays
US5768457A · kind A · utility
1Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1995 |
| Grant date | Jun 16, 1998 |
| Priority date | — |
| Expiry date | Nov 30, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/12004
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In many assembly applications of optical arrays, a bridging member is bonded to the arrays to hold them securely. It has been found that a pad made of layers of glass and silicon provides an efficient heat transmitting structure for this purpose. Because glass is absorbent to laser radiation at 10.6 .mu.m, it absorbs all the incident laser radiation, and imparts the heat generated to the silicon, which transmits it uniformly over its entire surface. The heat can then be used to melt solder or to heat-cure an adhesive, thereby affecting a robust mechanical bond in an efficient and rapid manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.