Heat pipe with embedded wick structure
US5769154A · kind A · utility
75Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1996 |
| Grant date | Jun 23, 1998 |
| Priority date | — |
| Expiry date | Jan 29, 2016 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/046
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pipe has an embedded wick structure that maximizes capillary pumping capability. Heat from attached devices such as integrated circuits evaporates working fluid in the heat pipe. The vapor cools and condenses on a heat dissipation surface. The condensate collects in the wick structure, where capillary pumping returns the fluid to high heat areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.