Apparatus and method for dicing semiconductor wafers
US5769297A · kind A · utility
Inventors
Key dates
| Filing date | Sep 10, 1996 |
| Grant date | Jun 23, 1998 |
| Priority date | — |
| Expiry date | Sep 10, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/371
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer to be diced to form chips is placed on the sticky side of a thin elastic film in the form of a Swiss Cross which is secured to the side members of a compressed but expandable square frame, the frame being placed in a scribing and dicing machine in its released state so that the frame and thus the film can expand during the dicing operation, further expansion being accomplished after dicing of the wafer by heating the film while in an expansion fixture to insure removal of the chips from the film without damaging adjacent chips. The sticky material on the film may be rendered less sticky after formation of the chips by exposure to ultraviolet energy or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.