Packaging of high power semiconductor lasers
US5770473A · kind A · utility
50Cited by
13References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1997 |
| Grant date | Jun 23, 1998 |
| Priority date | — |
| Expiry date | Apr 7, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02235
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The presence of oxygen in the laser atmosphere is counter to standard practice in the art which teaches the use of an atmosphere of a dry inert gas. The package also includes a getter for organic impurities, e.g., a getter composed of a porous silica or a zeolite. The hydrogen content of the materials used to form the package are reduced by baking at an elevated temperature for an extended period of time, e.g., at 150.degree. C. for 200 hours.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.