Amido- and imido- peroxycarboxylic acid bleach granules
US5770551A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1996 |
| Grant date | Jun 23, 1998 |
| Priority date | — |
| Expiry date | Aug 19, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D3/3945
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A bleach granule is provided with 60-100% being an intimate mixture of an amido or imido C.sub.2 -C.sub.30 peroxy acid and a surfactant, in a weight ratio of 20:1 to 1:20. The most preferred peroxyacids are N,N-phthaloylaminoperoxycaproic acid (PAP); monononylamide of either peroxysuccinic acid (NAPSA) or peroxyadipic acid (NAPAA) and N,N'-terephthaloyl-di(6-aminoperoxycaproic acid) (TPCAP). Localized dye damage from the peroxy acid bleach is prevented by the presence of the surfactant. Bleach compositions and a method for cleaning a stained substrate with the bleach granule are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.