Heatsink assembly for a high-power device
US5771154A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1997 |
| Grant date | Jun 23, 1998 |
| Priority date | — |
| Expiry date | Apr 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R1/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heatsink assembly (100) provides additional heat dissipation for a high-power integrated circuit package (102) contained within a communication product housing (130). There is an integral heatsink (104) protruding from the package. The heatsink frictionally mates with the first end (108) of a thermally conductive member (106). The second end (110) of the conductive member is magnetically-coupled to the rear surface (123) of a loudspeaker magnet (122). Tabs (111) extending away from the second end of the conductive member provide added mechanical support, preventing the second end from sliding against the rear surface of the magnet. Heat generated by the high-power device is transferred from the package heatsink, via the thermally conductive member, to the loudspeaker magnet such that heat is dissipated away from the package and toward the magnet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.