Molded encapsulated electronic component
US5773322A · kind A · utility
45Cited by
9References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 27, 1997 |
| Grant date | Jun 30, 1998 |
| Priority date | — |
| Expiry date | Jun 27, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molded encapsulated electronic component containing a silicon device, chip, or integrated circuit characterized by ease of fabrication and minimum possibility of breakage or dislocation, included a lead frame bearing a compressed, thin elastomeric, anisotropic, electrically conductive compliant interconnect on which the silicon integrated circuit is positioned--all mounted within an all-enveloping plastic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.