Low temperature sintered, resistive aluminum nitride ceramics
US5773377A · kind A · utility
13Cited by
20References
50Claims
0Family size
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Key dates
| Filing date | Jun 12, 1995 |
| Grant date | Jun 30, 1998 |
| Priority date | — |
| Expiry date | Jun 12, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An aluminum nitride ceramic having enhanced properties suitable for electronic packaging applications can be prepared from a synergistic aluminum nitride powder/sintering aid mixture, in which the sintering aid is formulated to provide a resultant desirable second phase within the sintered body. The aluminum nitride powder/sintering aid mixture can be formed into green sheet-metal laminates and sintered at low temperature to yield high density, high electrical resistivity, and high thermal conductivity metal ceramic sintered bodies with low camber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.