Patent · US Expired

Low-flammability polyamide molding materials

US5773556A · kind A · utility

29Cited by

9References

13Claims

0Family size

Assignee

Ticona LLC · US

Inventors

Hans-Jerg Kleiner · Kronberg, DE
Winfried Budzinsky · Bad Soden, DE
Gunther Kirsch · Bad Soden, DE

Key dates

Filing date	Feb 27, 1997
Grant date	Jun 30, 1998
Priority date	—
Expiry date	Feb 27, 2017

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB29L2031/3493
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Low-flammability polyamide molding materials are obtained by admixing calcium or aluminum phosphinates. These salts confer improved flame protection on polyamides compared with other metal salts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.