Method and arrangement for coupling a wave guide to a component

US5774609A · kind A · utility

Assignee

• Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

• Lennart Backlin · Stockholm, SE
• Ylva Backlund · Uppsala, SE
• Håkan Elderstig · Bromma, SE
• Stefan Lindgren · Vallentuna, SE
• Odd Steijer · Bromma, SE

Key dates

• Filing date: Jan 27, 1997
• Grant date: Jun 30, 1998
• Expiry date: Jan 27, 2017

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/3692
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Optical components intended for telecommunications purposes must be manufactured and mounted with a great degree of accuracy, since a component, such as an optochip, when mounted must be coupled optically, electrically, mechanically and thermally at the same time. In order to obtain a right-angled geometry when using surface-emitting or surface-detecting components, and to obtain a reduced optical travel path and accurate fixation of an optofiber, a reflective surface (12) which slopes at an angle of 45 degrees is arranged between a light-conducting core (16) and the active surface (10) of an optochip, and the light-conducting core has been placed closer to the reflective surface by bevelling the optofiber (9) and fitting the fiber in a V-groove and accurately fixating the fiber in the groove by means of a flat cover means (20). The aforesaid solutions relate generally to problems of a geometrical nature, but are able to provide important advantages in the arrangement of optical components in so-called optical micro-structures in comparison with earlier known techniques with regard to requirements of space, signal transmission performances and manufacturing costs.