Incorporating partially sintered preforms in metal matrix composites
US5775403A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1995 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Jun 7, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/128
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of fabricating MMCs having high thermal conductivity coupled with coefficient of thermal expansion (CTE) values which approximates the CTE of ceramics and semi-conductor materials typically used in electronic packaging. The method comprises preparing a formed agglomeration of powder particles (preform); partially sintering the preform; placing the partially sintered preform into a forming chamber; infiltrating the preform with liquid-phase metal; and allowing the liquid-phase metal to solidify and form an MMC around and through the preform. In a preferred embodiment, the preform is constructed from silicon carbide, and the metal matrix is an aluminum-silicon alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.