Apparatus for wirebonding using a tubular piezoelectric ultrasonic transducer
US5775567A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Mar 14, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In ultrasonic wirebonding apparatus, vibrations produced using a tubular piezoelectric (piezoceramic) actuator, driven by electrical current at an ultrasonic frequency, are used to provide energy for the wirebonding process. An assembly including means for mounting the actuator at a proximal end, the actuator itself, and a bonding tip extending from a distal end of the actuator, are moved by a carrier between the various points at which wirebonding is to occur. The bonding wire is fed through a passageway in this assembly. The carrier slides on a first carriage for movement into engagement with the workpiece. The first carriage slides in a first direction on a second carriage, which in turn slides in a second direction, to move between points at which wirebonding is to occur. The workpieces, such as circuit chips being manufactured, are moved into a workspace for wirebonding, are held therein during processing, and are subsequently removed from the workspace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.