Fabrication of compact magnetic circulator components in microwave packages using high density interconnections
US5776275A · kind A · utility
10Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Oct 21, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.