Semiconductor package and method thereof
US5776798A · kind A · utility
330Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Sep 4, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated by sawing through the encapsulant (19) and the underlying semiconductor package substrate (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.