Manufacture of electronic devices comprising thin-film circuitry on a polymer substrate
US5776803A · kind A · utility
66Cited by
7References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 15, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Oct 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/967
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a large-area electronic device such as a flat panel display, which method includes subjecting a semiconductor film on a polymer substrate to an energy beam treatment, e.g., for crystal growth or to anneal an ion implant, and masking the substrate prior to treatment to prevent exposure to the energy beam, wherein the adhesion of the film and other layers on the substrate is improved by first heating the substrate to pre-shrink it, and then depositing the layers on the pre-shrunk substrate at a lower temperature than the heating temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.