Encapsulated fuse having a conductive polymer and non-cured deoxidant
US5777540A · kind A · utility
30Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 1996 |
| Grant date | Jul 7, 1998 |
| Priority date | — |
| Expiry date | Jan 29, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H85/18
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A simplified method of manufacturing an electrothermal fuse includes the steps of screening conductive epoxy onto fuse link termination pads, placing a metal alloy fuse link into the conductive epoxy on the termination pads, curing the conductive epoxy, applying deoxidant, applying encapsulant, and curing the encapsulant. The resultant fuse of the preferred embodiment comprises a substrate, termination pads, conductive epoxy interconnects, a solder type fuse link, liquid deoxidant and encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.